常用集成电路的封装形式 |
|
CLCC
|
|
DIP
Dual Inline Package
|
|
DIP-tab
Dual Inline Package with Metal Heatsink |
|
FBGA |
|
FDIP |
|
FTO220 |
|
Flat Pack |
|
HSOP28 |
|
ITO220 |
|
ITO3p |
|
JLCC |
|
LCC |
|
LDCC |
|
LGA |
|
LQFP |
|
PCDIP |
|
PLCC
|
|
PQFP |
|
PSDIP |
|
LQFP 100L
|
|
METAL QUAD 100L
|
|
PQFP 100L
|
|
QFP
Quad Flat Package |
|
SOT143 |
|
SOT220 |
|
SOT223 |
|
SOT223 |
|
SOT23 |
|
SOT23/SOT323 |
|
SOT25/SOT353 |
|
SOT26/SOT363 |
|
SOT343 |
|
SOT523 |
|
SOT89 |
|
SOT89 |
|
LAMINATE TCSP 20L
Chip Scale Package
|
|
TO252 |
|
TO263/TO268 |
|
SO DIMM
Small Outline Dual In-line Memory Module |
|
QFP
Quad Flat Package |
|
TQFP 100L
|
|
SBGA |
|
SC-70 5L
|
|
SDIP |
|
SIP
Single Inline Package |
|
SO
Small Outline Package |
? |
? |
|
SOJ 32L
|
|
SOJ |
|
SOP EIAJ TYPE II 14L
|
|
SOT220 |
|
SSOP 16L
|
|
SSOP |
|
TO18 |
|
TO220 |
|
TO247 |
|
TO264 |
|
TO3 |
|
TO5 |
|
TO52 |
|
TO71 |
|
TO72 |
|
TO78 |
|
TO8 |
|
TO92 |
|
TO93 |
|
TO99 |
|
TSOP
Thin Small Outline Package |
|
TSSOP or TSOP II
Thin Shrink Outline Package |
|
uBGA
Micro Ball Grid Array |
|
? |
|
ZIP
Zig-Zag Inline Package |
|
BQFP132 |
TEPBGA 288L |
TEPBGA 288L
|
|
C-Bend Lead |
|
CERQUAD
Ceramic Quad Flat Pack
|
|
Ceramic Case |
|
Gull Wing Leads |
J-STD |
J-STD
Joint IPC / JEDEC Standards |
JEP |
JEP
JEDEC Publications |
JESD |
JESD
JEDEC Standards |
|
LLP 8La
|
|
PCMCIA |
|
PDIP |
|
PLCC
|
PS/2 |
PS/2
mouse port pinout
|
SIMM30 |
SIMM30
Pinout
|
SIMM72 |
SIMM72
Pinout
|
|
SNAPTK |
|
SNAPTK |
|
SNAPZP |
|
SOH |
